Hardware adapter device

ABSTRACT

Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.

This is a continuation application of co-pending U.S. application Ser.No. 15/958,600, filed Apr. 20, 2018, which is incorporated herein byreference.

TECHNICAL FIELD

The present disclosure relates to methods, devices, and systems for ahardware adapter device.

BACKGROUND

Control systems in a building may be utilized by a building automationsystem in order to control systems in the building. For example,centralized control of a heating, ventilation, and air-conditioning(HVAC) system of a building may be realized by a building automationsystem.

A building automation system can utilize controllers to control systems,such as HVAC systems, in a building. Controllers can utilize differentinputs to determine information about devices included in a buildingautomation system. For example, a building controller can utilize inputssuch as temperature, pressure, and/or humidity, among other inputs, todetermine information about equipment in a building's HVAC system, suchas the status of a boiler.

Controllers can output various signals to devices included in a buildingautomation system. For example, a controller can output a signal to aboiler to increase a supply water temperature output from the boiler.

The inputs and outputs of a controller can include different types ofsignals. For example, the types of signals may include an analoginput/output signal, a binary input/output signal, and/or a digitalinput/output signal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a hardware adapter device, in accordancewith embodiments of the present disclosure.

FIG. 2 is a top view of a hardware adapter device, in accordance withembodiments of the present disclosure.

FIG. 3 is a perspective view of printed circuit boards (PCBs) of ahardware adapter device, in accordance with embodiments of the presentdisclosure.

FIG. 4 is a perspective view of a system including a hardware adapterdevice, in accordance with embodiments of the present disclosure.

FIG. 5A is a perspective view of a system including a hardware adapterdevice and a locking mechanism in an unlocked position, in accordancewith embodiments of the present disclosure.

FIG. 5B is a perspective view of a system including a hardware adapterdevice and a locking mechanism in a locked position, in accordance withembodiments of the present disclosure

FIG. 6 is a block diagram of a system, in accordance with embodiments ofthe present disclosure.

DETAILED DESCRIPTION

Methods, devices, and systems for a hardware adapter device aredescribed herein. One device includes housing, a plurality of printedcircuit boards (PCBs) housed by the housing, where each of the pluralityof PCBs include traces, and a switch to select a bus addresscorresponding to the hardware adapter device, where the housing receivesan input/output (I/O) module such that the traces of the PCBs provide anelectrical path from a wiring baseboard to the I/O module.

Controllers utilized in a building automation system can allow forefficient operation of building systems. Further, the controllers can,in some examples, reduce energy consumption and operating costs ofvarious building systems.

Efficient operation of building systems can depend on the buildingcontrollers in use. For example, older building controllers may not workas well as newer, more efficient building controllers. However,incorporation of newer building controllers into existing buildingsystems may be difficult, since newer controllers may not be wiredcorrectly for use in older building automation systems.

Replacing older and/or less efficient building controllers can bearduous and lengthy. For example, wiring baseboards may need to beremoved and connections rewired for use with a newer buildingcontroller. Rewiring baseboards can cause high labor costs as well assignificant downtime to a consumer, such as a building owner oroperator, during a changeover from older to newer building controllers.

Embodiments of the present disclosure can allow for replacement of olderand/or less efficient building controllers without the need to removeand/or rewire connections of a wiring baseboard. By avoiding the need toremove and/or rewire the wiring baseboard, older and/or less efficientbuilding controllers can be replaced more quickly, reducing consumerdowntime and cost.

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof. The drawings show by wayof illustration how embodiments of the disclosure may be practiced.

These embodiments are described in sufficient detail to enable those ofordinary skill in the art to practice embodiments of this disclosure. Itis to be understood that other embodiments may be utilized and thatprocess, electrical, and/or structural changes may be made withoutdeparting from the scope of the present disclosure.

As will be appreciated, elements shown in the various embodiments hereincan be added, exchanged, combined, and/or eliminated so as to provide anumber of additional embodiments of the present disclosure. Theproportion and the relative scale of the elements provided in thefigures are intended to illustrate the embodiments of the presentdisclosure, and should not be taken in a limiting sense.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.

FIG. 1 is a perspective view of a hardware adapter device 100, inaccordance with embodiments of the present disclosure. As illustrated inFIG. 1, hardware adapter device 100 can include a housing 102. Housing102 can include channels 126 and protrusions 130.

Although not illustrated in FIG. 1 for clarity and so as not to obscureembodiments of the present disclosure, housing 102 can include aplurality of printed circuit boards (PCBs), as further described inconnection with FIGS. 3 and 4. As used herein, the term “PCB” can, forexample, refer to a board that mechanically supports and electricallyconnects electrical components using conductive tracks (e.g., traces),pads, and/or other methods of electrical connection. The traces can, forexample, be etched from sheets of material laminated onto a substrate.

Housing 102 can be of a plastic material. For instance, in someexamples, housing 102 may be formed of a thermoplastic polymer resin.Examples of suitable thermoplastic polymer resins may include ultra-lowdensity polyethylene, very low density polyethylene (“VLDPE”), linearlow density polyethylene (“LLDPE”), low density polyethylene (“LDPE”),medium density polyethylene (“MDPE”), high density polyethylene(“HDPE”), polypropylene, isotactic polypropylene, highly isotacticpolypropylene, syndiotactic polypropylene, random copolymer of propyleneand ethylene and/or butene and/or hexene, elastomers such as ethylenepropylene rubber, ethylene propylene diene monomer rubber, neoprene, andblends of thermoplastic polymers and elastomers, such as for example,thermoplastic elastomers and rubber toughened plastics. In someexamples, housing 102 may be formed of polyethylene terephthalate (PET).However, examples of the disclosure are not limited to the abovedescribed materials. For example, housing 102 may be formed of any othertype of material.

Although not illustrated in FIG. 1 for clarity and so as not to obscureexamples of the present disclosure, housing 102 can include a switch.The switch can select a bus address corresponding to hardware adapterdevice 100, as is further described in connection with FIGS. 2 and 6.

Housing 102 can receive an input/output (I/O) module. As used herein,the term “I/O” module can, for example, refer to a device which controlsa data exchange between other devices. For example, the I/O module canreceive a data input from one device, modify the data input, and outputthe modified data input to another device. For instance, the I/O modulecan receive an input (e.g., an analog, binary, and/or digital input) andgenerate an output (e.g., an analog, binary, and/or digital output).

Housing 102 can receive a new I/O module. For example, the plurality ofPCBs included in housing 102 can be coupled to an existing wiringbaseboard such that the plurality of PCBs can provide an electrical pathfrom the existing wiring baseboard to the new I/O module, as is furtherdescribed in connection with FIG. 5. In other words, housing 102 can beutilized to replace an old I/O module connected to an existing wiringbaseboard, and enable the use of a new I/O module with the existingwiring baseboard.

Housing 102 can include channels 126. As used herein, the term “channel”can, for example, refer to a groove in a piece of material. For example,housing 102 can include grooves on an inner surface of the material ofhousing 102.

As illustrated in FIG. 1, channels 126 can be shaped in a “T” shape.However, embodiments of the present disclosure are not limited toT-shaped channels 126. For example, channels 126 can be any other shapedchannels.

As illustrated in FIG. 1, housing 102 can include four channels 126.However, embodiments of the present disclosure are not limited to fourchannels 126. For example, housing 102 can include less than fourchannels, or more than four channels.

Channels 126 can be shaped to receive protrusions included in the newI/O module that can be received by housing 102. For example, theprotrusions included on the I/O module can be similarly T-shaped suchthat the protrusions fit into the T-shaped channels 126 of housing 102.The channels 126 can align connection pins of the I/O module withreceiving terminals of a PCB of the plurality of PCBs housed by housing102, as is further described in connection with FIGS. 3-5.

As illustrated in FIG. 1, housing 102 can include a plurality ofprotrusions 130 on an outer surface of the material of housing 102. Theprotrusions 130 can be T-shaped. The T-shaped protrusions of housing 102can be shaped to fit in channels included in the existing wiringbaseboard, as is further described in connection with FIG. 5.

FIG. 2 is a top view of a hardware adapter device 200, in accordancewith embodiments of the present disclosure. As illustrated in FIG. 2,hardware adapter device 200 can include housing 202, plurality of PCBs204, rotary switch 206, channels 226, and protrusions 230. The pluralityof PCBs 204 can include receiving terminals 216.

As described above, hardware adapter device 200 can include housing 202.Housing 202 can house a plurality of PCBs. In some examples, aparticular PCB can include receiving terminals 216. As used herein, theterm “receiving terminal” can, for example, refer to female pin headersto receive connection pins. For example, receiving terminals 216 canreceive connection pins from an I/O module. The receiving terminals 216can receive the connection pins from the I/O module such that theparticular PCB including receiving terminals 216 can be electricallyconnected to the I/O module.

As described in connection with FIG. 1, housing 202 can receive the I/Omodule. The housing 202 can receive the I/O module such that the I/Omodule is secured within housing 202. For example, in the orientationillustrated in FIG. 2, the housing 202 can receive the I/O module as theI/O module is moved “into” the page towards housing 202.

As previously described in connection with FIG. 1, housing 202 caninclude channels 226 to receive protrusions on the I/O module. Channels226 can be T-shaped channels. Channels 226 can receive thecorrespondingly shaped protrusions on the I/O module such that channels226 can align connection pins on the I/O module with receiving terminals216 of the particular PCB of the plurality of PCBs 204 housed by housing202. Once seated in housing 202, connection pins of the I/O module canbe coupled to receiving terminals 216, electrically connecting the I/Omodule to the plurality of PCBs 204.

As previously described in connection with FIG. 1, housing 202 caninclude protrusions 230. The protrusions 230 can be on an outer surfaceof housing 202 and can be T-shaped. As hardware adapter device 200 isconnected to the existing wiring baseboard, protrusions 230 can fit intocorrespondingly shaped channels included in the existing wiringbaseboard such that connection pins of the plurality of PCBs 204 alignwith receiving terminals of the existing wiring baseboard, as is furtherdescribed in connection with FIG. 5.

Housing 202 can include switch 206. Switch 206 can be a rotary switch.As used herein, the term “rotary switch” can, for example, refer to aswitch operated by rotation. Rotary switch 206 can determine a busaddress of hardware adapter device 200, as is further described inconnection with FIG. 6.

FIG. 3 is a perspective view of PCBs 304 of a hardware adapter device,in accordance with embodiments of the present disclosure. As illustratedin FIG. 3, the plurality of PCBs 304 can include a first PCB 308, asecond PCB 310 and a third PCB 312.

First PCB 308 can be housed by a housing (e.g., housing 102, 202,previously described in connection with FIGS. 1 and 2). First PCB 308can be electrically connected to third PCB 312.

First PCB 308 can include a plurality of connection pins 309. Theplurality of connection pins 309 can be received by receiving terminalsof a wiring baseboard. For example, the plurality of connection pins offirst PCB 308 can be inserted into receiving terminals of a wiringbaseboard.

The first PCB 308 can be electrically connected to the wiring baseboardvia the plurality of connection pins 309 of first PCB 308. For example,based on the connection pins 309 being coupled with the receivingterminals of the wiring baseboard, first PCB 308 can be electricallyconnected to the wiring baseboard.

Second PCB 310 can be housed by a housing (e.g., housing 102, 202,previously described in connection with FIGS. 1 and 2). Second PCB 310can be electrically connected to a first PCB (e.g., first PCB 408, as isdescribed in connection with FIG. 4).

As illustrated in FIG. 3, second PCB 310 can include a plurality ofconnection pins 311. Connection pins 311 can be received by receivingterminals of a wiring baseboard. For example, connection pins 311 can beinserted into receiving terminals of a wiring baseboard.

The second PCB 310 can be electrically connected to the wiring baseboardvia the connection pins 311. For example, based on the connection pins311 being coupled with the receiving terminals of the wiring baseboard,second PCB 310 can be electrically connected to the wiring baseboard.

Third PCB 312 can be housed by a housing (e.g., housing 102, 202,previously described in connection with FIGS. 1 and 2). Third PCB 312can be electrically connected to a first PCB (e.g., first PCB 408, as isdescribed in connection with FIG. 4) and second PCB 310. In someexamples, the first PCB and second PCB 310 can include connection pins,and third PCB 312 can include receiving terminals such that the firstPCB and second PCB 310 can be electrically connected via the connectionpins of the first PCB and second PCB 310 and the receiving terminals ofthird PCB 312. However, embodiments of the present disclosure are not solimited. For instance, in some examples, the first PCB and second PCB310 can include receiving terminals, and third PCB 312 can includeconnection pins such that the first PCB and second PCB 310 can beelectrically connected via the receiving terminals of the first PCB andsecond PCB 310 and the connection pins of third PCB 312, or combinationsthereof.

As illustrated in FIG. 3, third PCB 312 can include receiving terminals316. Receiving terminals 316 can couple to connection pins of an I/Omodule. For example, connection pins of the I/O module can be insertedinto receiving terminals 316 of third PCB 312.

The third PCB 312 can be electrically connected to the I/O module viathe connection pins of the I/O module (e.g., not shown in FIG. 3) andreceiving terminals 316 of third PCB 312. For example, based on theconnection pins of the I/O module being coupled with the receivingterminals 316 of third PCB 312, third PCB 312 can be electricallyconnected to the I/O module.

First PCB 308 and third PCB 312 can be oriented parallel to each otherwhen housed by the housing of the hardware adapter device. However,embodiments of the present disclosure are not so limited. For example,first PCB 308 and third PCB 312 can be oriented in a substantiallyparallel orientation relative to each other when housed by the housingof the hardware adapter device.

As used herein, the term “substantially” intends that the characteristicdoes not have to be absolute, but is close enough so as to achieve thecharacteristic. For example, “substantially normal” is not limited toabsolute normal. For example, “substantially parallel” is not limited toabsolutely parallel.

As illustrated in FIG. 3, second PCB 310 can be oriented normal to thirdPCB 312. For example, second PCB 310 can be oriented perpendicularlywith respect to third PCB 312. However, embodiments of the presentdisclosure are not so limited. For example, second PCB 310 can beoriented in a substantially normal orientation relative to third PCB312.

Second PCB 310 can be oriented normal to first PCB 308. For example,second PCB 310 can be oriented perpendicularly with respect to first PCB308 when housed by the housing of the hardware adapter device. However,embodiments of the present disclosure are not so limited. For example,second PCB 310 can be oriented in a substantially normal orientationrelative to first PCB 308 when housed by the housing of the hardwareadapter device.

FIG. 4 a perspective view of a system 420 including a hardware adapterdevice, in accordance with embodiments of the present disclosure. Asillustrated in FIG. 4, system 420 can include housing 402, I/O module422, and wiring baseboard 424. Housing 402 can include channels 426 andprotrusions 430.

As illustrated in FIG. 4, the hardware adapter device can be included aspart of a hardware adapter system. Housing 402 can be coupled to wiringbaseboard 424 and can include I/O module 422. The hardware adaptersystem can be utilized to replace old I/O modules with new I/O modules(e.g., I/O module 422) without rewiring wiring baseboard 424, as isfurther described herein.

As previously described in connection with FIGS. 1-3, the hardwareadapter device can include housing 402. Housing 402 can house a firstPCB (e.g., PCB 308, previously described in connection with FIG. 3), asecond PCB (e.g., second PCB 310, previously described in connectionwith FIG. 3), and a third PCB (e.g., PCB 312, previously described inconnection with FIG. 3).

The first PCB can include connection pins. The connection pins of thefirst PCB can be coupled to receiving terminals of wiring baseboard 424.The connection pins of the first PCB being coupled to receivingterminals of wiring baseboard 424 can allow for the first PCB to beelectrically connected to wiring baseboard 424.

The second PCB can include connection pins. The connection pins of thesecond PCB can be coupled to receiving terminals of wiring baseboard424. The connection pins of the second PCB can be coupled to receivingterminals that are different than the receiving terminals the first PCBis coupled to. The connection pins of the second PCB being coupled toreceiving terminals of wiring baseboard 424 can allow for the second PCBto be electrically connected to wiring baseboard 424.

The third PCB can be electrically connected to the first PCB and thesecond PCB via a combination of connection pins and receiving terminals.The third PCB can include receiving terminals to couple to connectionpins of I/O module 422. The receiving terminals being coupled to theconnection pins of I/O module 422 can allow for the third PCB to beelectrically connected to I/O module 422.

Based on the electrical connections of the first PCB, the second PCB,and the third PCB, an electrical connection can be made between wiringbaseboard 424 and I/O module 422. For example, the first PCB, the secondPCB, and the third PCB can include electrical traces such that anelectrical connection is made between wiring baseboard 424 and I/Omodule 422.

The first PCB, the second PCB, and the third PCB can be used to migrate(e.g., upgrade, update, and/or replace) existing I/O modules connectedto wiring baseboard 424 with new I/O modules (e.g., I/O module 422). Forexample, although not shown in FIG. 4 for clarity and so as not toobscure embodiments of the present disclosure, an existing I/O modulecan be removed from the wiring baseboard 424. The wiring baseboard 424can be left intact (e.g., the wiring baseboard 424 is not removed and/orrewired).

An existing I/O module can be replaced using new I/O module 422 by usingthe hardware adapter device (e.g., hardware adapter device 100, 200,previously described in connection with FIGS. 1 and 2, respectively).The hardware adapter device can include the first PCB, second PCB, andthird PCB that are housed by the housing 402 of the hardware adapterdevice to provide an electrical connection between I/O module 422 andwiring baseboard 424 such that an electric current can flow between I/Omodule 422 and wiring baseboard 424.

As previously described in connection with FIGS. 1 and 2, housing 402can include channels 426. Channels 426 can be shaped to receiveprotrusions included on an outer surface of I/O module 422.

For example, channels 426 located on an inner surface of housing 402 canbe T-shaped, and protrusions included on the outer surface of I/O module422 can be correspondingly T-shaped. As a result, T-shaped channels 426of housing 402 can receive T-shaped protrusions of I/O module 422 suchthat the T-shaped channels 426 align connection pins of I/O module 422with receiving terminals of the third PCB included in housing 402. Thechannels 426 can ensure the connection pins of I/O module 422 arealigned with receiving terminals of the third PCB so that a user caneasily connect I/O module 422 with the hardware adapter device.

As previously described in connection with FIGS. 1 and 2, housing 402can include protrusions 430. Protrusions 430 can be included on an outersurface of housing 402.

For example, protrusions 430 located on the outer surface of housing 502can be T-shaped, and channels located on wiring baseboard 524 can becorrespondingly T-shaped. As a result, T-shaped protrusions 430 ofhousing 402 can fit in the T-shaped channels of wiring baseboard 424such that the T-shaped protrusions 430 align connection pins of PCBshoused by housing 402 with receiving terminals of wiring baseboard 424.The protrusions 430 can ensure the connection pins of the PCBs locatedin housing 402 are aligned with the receiving terminals of wiringbaseboard 424 so that a user can easily connect the hardware adapterdevice with wiring baseboard 424.

FIG. 5A is a perspective view of a system 523 including a hardwareadapter device and a locking mechanism in an unlocked position, inaccordance with embodiments of the present disclosure. As illustrated inFIG. 5A, system 523 can include housing 502, wiring baseboard 524, andlocking mechanism 536.

As illustrated in FIG. 5, wiring baseboard 524 can include a lockingmechanism 536. For example, the locking mechanism 536 can secure thehardware adapter device 502 to wiring baseboard 524 when the first PCBand the second PCB are coupled to the wiring baseboard 524. Forinstance, when the connection pins of the first PCB and the second PCBare fully inserted into the receiving terminals of wiring baseboard 524,the T-shaped protrusions 530 can clear the locking mechanism 536. Asillustrated in FIG. 5A, locking mechanism 536 is in an unlockedposition.

FIG. 5B is a perspective view of a system 523 including a hardwareadapter device and a locking mechanism in a locked position, inaccordance with embodiments of the present disclosure. As illustrated inFIG. 5B, system 523 can include housing 502, wiring baseboard 524, andlocking mechanism 536.

As previously described in connection with FIG. 5A, locking mechanism536 can secure hardware adapter device 502 to wiring baseboard 524 whenthe first PCB and the second PCB are coupled to the wiring baseboard524. As a result of the connection pins of the first PCB and the secondPCB being fully inserted into the receiving terminals of wiringbaseboard 524, the locking mechanism 536 of wiring baseboard 524 can beengaged. For example, the locking mechanism 536 can be moved in thedirection indicated in FIG. 5B in order to engage locking mechanism 536in order to lock hardware adapter device 502 to wiring baseboard 524.

The locking mechanism 536 of wiring baseboard 524 can serve to notifythe user that the hardware adapter device is connected to wiringbaseboard 524, as the locking mechanism 536 may not be able to beengaged if the connection pins of the first PCB and the second PCB arenot fully inserted into the receiving terminals of wiring baseboard 524.

FIG. 6 is a block diagram of a system 632, in accordance withembodiments of the present disclosure. As illustrated in FIG. 6, thesystem 632 can include a wiring baseboard 624, controller 634, andhardware adapter devices 600-1, 600-2, 600-3, 600-N (referred tocollectively herein as hardware adapter devices 600).

As previously described in connection with FIGS. 1-5, each of hardwareadapter devices 600 can include a housing that houses a first PCB, asecond PCB, and a third PCB. The first PCB can include connection pins.The connection pins of the first PCB can be coupled to receivingterminals of wiring baseboard 624. The connection pins of the first PCBbeing coupled to receiving terminals of wiring baseboard 624 can allowfor the first PCB to be electrically connected to wiring baseboard 624.

The second PCB can include connection pins. The connection pins of thesecond PCB can be coupled to different receiving terminals of wiringbaseboard 624 than that of the first PCB of each hardware adapter device600. The connection pins of the second PCB being coupled to receivingterminals of wiring baseboard 624 can allow for the second PCB to beelectrically connected to wiring baseboard 624.

The third PCB can be electrically connected to the first PCB and thesecond PCB via a combination of connection pins and receiving terminals.The third PCB can include receiving terminals to couple to connectionpins of an I/O module. For example, each of the hardware adapter devices600 can include an I/O module. The receiving terminals being coupled tothe connection pins of the I/O module can allow for the third PCB to beelectrically connected to the I/O module.

Based on the electrical connections of the first PCB, the second PCB,and the third PCB of each hardware adapter device 600, an electricalconnection can be made between wiring baseboard 624 and the I/O moduleof each of the hardware adapter devices 600. For example, the first PCB,the second PCB, and the third PCB can include electrical traces suchthat an electrical connection is made between wiring baseboard 624 andthe I/O modules of each of the hardware adapter devices 600.

Although not illustrated in FIG. 6 for clarity and so as not to obscureembodiments of the present disclosure, each hardware adapter device 600can include a rotary switch. The rotary switch can determine a busaddress of each hardware adapter device 600.

The bus address can be a unique bus address for that respective hardwareadapter device 600. For example, the rotary switch of hardware adapterdevice 600-1 can determine a first bus address for hardware adapterdevice 600-1. Similarly, the rotary switch of hardware adapter device600-2 can determine a second bus address for hardware adapter device600-2, the rotary switch of hardware adapter device 600-3 can determinea third bus address for hardware adapter device 600-3, the rotary switchof hardware adapter device 600-N can determine an Nth bus address forhardware adapter device 600-N.

As illustrated in FIG. 6, system 632 can include controller 634.Controller 634 can include hardware and/or software for use in receivingsignals from various devices included in a building automation system,as well as outputting various signals to the devices included in thebuilding automation system. For instance, controller 634 can receiveand/or transmit signals to devices included in the building automationsystem. For example, controller 634 can be used for monitoring and/orcontrolling devices included in electrical, plumbing, and/or HVACsystems of a building automation system, among other applications. Forinstance, hardware adapter devices 600 can communicate signals withcontroller 634 and wiring baseboard 624 for use in an HVAC controlsystem of a building.

Controller 634 can communicate with each I/O module of each hardwareadapter device 600 based on the unique defined bus address for each ofthe hardware adapter devices 600. For example, controller 634 cancommunicate with the I/O module of hardware adapter device 600-1 basedon the unique bus address of hardware adapter device 600-1, determinedby the rotary switch of hardware adapter device 600-1. Similarly,controller 634 can communicate with the I/O module of hardware adapterdevice 600-2 based on the unique bus address of hardware adapter device600-2, determined by the rotary switch of hardware adapter device 600-2,communicate with the I/O module of hardware adapter device 600-3 basedon the unique bus address of hardware adapter device 600-3, determinedby the rotary switch of hardware adapter device 600-3, and cancommunicate with the I/O module of hardware adapter device 600-N basedon the unique bus address of hardware adapter device 600-N, determinedby the rotary switch of hardware adapter device 600-N.

A hardware adapter device can allow for the replacement of existing I/Omodules on an existing wiring baseboard with newer technology, such asnew and/or updated I/O modules and/or controllers. For example, hardwareadapter devices 600 can connect to the wiring baseboard 624 to allow forthe replacement of existing I/O modules and/or controllers with new I/Omodules and/or controllers, by providing updated electrical connectionsvia PCBs included in each hardware adapter device 600.

Providing the electrical connections needed to update existing I/Omodules and/or controllers PCBs included in hardware adapter devices 600can eliminate the need to remove and rewire connections of a wiringbaseboard. By not having to remove and rewire connections, high laborcosts and significant downtime during a changeover from older to newerI/O modules and/or controllers can be avoided.

Additionally, the PCBs being included in the housings of the hardwareadapter devices 600 can allow for installation of upgraded equipmentwhile maintaining the original footprint of the existing I/O modulesand/or controllers being replaced, preventing the need to findadditional space in the wiring baseboard 624. Further, no permanentmodification of the existing wiring panel is required, allowing for theoption to revert to older I/O modules and/or controllers.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anyarrangement calculated to achieve the same techniques can be substitutedfor the specific embodiments shown. This disclosure is intended to coverany and all adaptations or variations of various embodiments of thedisclosure.

It is to be understood that the above description has been made in anillustrative fashion, and not a restrictive one. Combination of theabove embodiments, and other embodiments not specifically describedherein will be apparent to those of skill in the art upon reviewing theabove description.

The scope of the various embodiments of the disclosure includes anyother applications in which the above structures and methods are used.Therefore, the scope of various embodiments of the disclosure should bedetermined with reference to the appended claims, along with the fullrange of equivalents to which such claims are entitled.

In the foregoing Detailed Description, various features are groupedtogether in example embodiments illustrated in the figures for thepurpose of streamlining the disclosure. Similar elements or componentsbetween different figures may be identified by the use of similardigits. For example, 102 may reference element “02” in FIG. 1, and asimilar element may be referenced as 202 in FIG. 2. As used herein, thedesignator “N”, particularly with respect to reference numerals in thedrawings, indicate that a plurality of the particular feature sodesignated can be included with examples of the disclosure.

This method of disclosure is not to be interpreted as reflecting anintention that the embodiments of the disclosure require more featuresthan are expressly recited in each claim. Rather, as the followingclaims reflect, inventive subject matter lies in less than all featuresof a single disclosed embodiment. Thus, the following claims are herebyincorporated into the Detailed Description, with each claim standing onits own as a separate embodiment.

What is claimed:
 1. A hardware adapter device for use in migrating anexisting I/O module connected to a wiring baseboard to a new I/O module,the hardware adapter device comprising: a first electrical connector forconnecting to a corresponding connector of the new I/O module; a secondelectrical connector for connecting to a corresponding connector of thewiring baseboard; a housing that houses the first electrical connectorand the second electrical connector, wherein the housing comprises oneor more first alignment features that are configured to interact withone or more alignment features of the new I/O module to align the firstelectrical connector with the corresponding connector of the new I/Omodule before the first electrical connector engages the correspondingconnector of the new I/O module; and wherein the housing furthercomprises one or more second alignment features that are configured tointeract with one or more alignment features of the wiring baseboard toalign the second electrical connector with the corresponding connectorof the wiring baseboard before the second electrical connector engagesthe corresponding connector of the wiring baseboard.
 2. The hardwareadapter device of claim 1, wherein the first electrical connector facesin a first direction and the second electrical connector faces in asecond direction opposite to the first direction.
 3. The hardwareadapter device of claim 2, further comprises a first printed wiringboard housed by the housing, wherein the first electrical connector ismounted to the first printed wiring board.
 4. The hardware adapterdevice of claim 3, wherein the housing includes first housing walls thatterminate above the first electrical connector in the first direction.5. The hardware adapter device of claim 4, wherein the one or more firstalignment features extend along at least part of the first housing wallsabove the first electrical connector and are configured to initiallyengage the one or more alignment features of the new I/O module beforethe first electrical connector engages the corresponding connector ofthe new I/O module.
 6. The hardware adapter device of claim 5, furthercomprises a second printed wiring board housed by the housing, whereinthe second electrical connector is mounted to the second printed wiringboard.
 7. The hardware adapter device of claim 5, wherein the housingincludes second housing walls that terminate below the second electricalconnector in the second direction.
 8. The hardware adapter device ofclaim 7, wherein the one or more second alignment features extend alongat least part of the second housing walls below the second electricalconnector and are configured to initially engage the one or morealignment features of the wiring baseboard before the second electricalconnector engages the corresponding connector of the wiring baseboard.9. The hardware adapter device of claim 5, wherein the first housingwalls define an aperture, and at least part of the new I/O module isconfigured to slide into the aperture after the one or more firstalignment features of the housing begin interacting with one or morealignment features of the new I/O module to align the first electricalconnector with the corresponding connector of the new I/O module beforethe first electrical connector engages the corresponding connector ofthe new I/O module.
 10. The hardware adapter device of claim 1, whereinthe one or more first alignment features comprise a channel.
 11. Thehardware adapter device of claim 10, wherein the channel comprises aT-shaped channel.
 12. The hardware adapter device of claim 1, whereinthe one or more second alignment features comprise a protrusion.
 13. Thehardware adapter device of claim 12, wherein the protrusion comprises aT-shaped protrusion.
 14. A hardware adapter device for use in migratingan existing I/O module connected to a wiring baseboard to a new I/Omodule, the hardware adapter device comprising: an electrical circuitfor providing a connection between a connector of the wiring baseboardand a connector of the new I/O module, the electrical circuitcomprising: a first electrical connector for connecting to the connectorof the new I/O module; a second electrical connector for connecting tothe connector of the wiring baseboard; a housing that houses theelectrical circuit, wherein the housing comprises: one or more firstalignment features that are configured to interact with one or morealignment features of the new I/O module to align the first electricalconnector with the connector of the new I/O module before the firstelectrical connector engages the connector of the new I/O module; andone or more second alignment features that are configured to interactwith one or more alignment features of the wiring baseboard to align thesecond electrical connector with the connector of the wiring baseboardbefore the second electrical connector engages the connector of thewiring baseboard.
 15. The hardware adapter device of claim 14, whereinthe electrical circuit comprises a printed circuit board, with the firstelectrical connector mounted to the printed circuit board.
 16. Thehardware adapter device of claim 14, wherein the first electricalconnector faces in a first direction and the second electrical connectorfaces in a second direction opposite to the first direction.
 17. Thehardware adapter device of claim 14, wherein the one or more firstalignment features comprise a channel.
 18. A method for migrating anexisting I/O module connected to a wiring baseboard to a new I/O module,the method comprising: removing the existing I/O module from the wiringbaseboard; connecting a hardware adapter device to the wiring baseboard,comprising: engaging one or more first alignment features of thehardware adapter device with one or more corresponding alignmentfeatures of the wiring baseboard to align the hardware adapter devicewith the wiring baseboard; after the one or more first alignmentfeatures of the hardware adapter device are engaged with the one or morecorresponding alignment features of the wiring baseboard, sliding thehardware adapter device toward the wiring baseboard until a secondconnector of the hardware adapter device begins to engage acorresponding connector of the wiring baseboard; and continuing to slidethe hardware adapter device toward the wiring baseboard into a seatedposition; connecting the new I/O module to the hardware adapter device,comprising: engaging one or more alignment features of the new I/Omodule with one or more second alignment features of the hardwareadapter device to align the new I/O module with the hardware adapterdevice; after the one or more alignment features of the new I/O moduleare engaged with the one or more second alignment features of thehardware adapter device, sliding the new I/O module toward the hardwareadapter device until a connector of the new I/O module begins to engagea first connector of the hardware adapter device; continuing to slidethe new I/O module toward the hardware adapter device into a seatedposition.